VT-S730

Improvement Cycle for High-quality Product Manufacturing

The efficient improvement cycle ensuring the output of high-quality products promotes the "minimization of quality costs".
This can further intensify the environment for quality improvement initiatives.

Process Control

Quality control during the PCB production process and efforts in process improvement with the post-reflow quality as the starting point are possible.

* v-DB compatibility with the X700 is currently under development.

Technologies Supporting 3D-SJI [Patent Pending]

Uses an optimal principle enabling a stable inspection of the reflection surface such as a solder joint.

The vertical startup of inspection programs is possible thanks to the combination of the Color Highlight TM 3D shape reconstruction and phase-shift principle.

* Requires post-reflow PCB and mount data.

* Light reflection on adjacent components or solders

Enables detecting solders under the components, which is physically undetectable from direct view