Item | Description | ||
---|---|---|---|
Model | VT-X700-E | VT-X700-L | |
Inspected components | BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips,
bottom-side terminal components, QFN, Power devices |
||
Inspected items | Openings, non-wet, solder amount, shifting, foreign object stuck,
bridging, lead presence, etc. (selectable to suit detected item) |
||
Imaging
specifications |
Imaging method | 3D-slice imaging using parallel CT | |
Resolution | 10, 15, 20, 25 or 30 μm (selectable to suit detected item) | ||
X-ray source | Micro-focus closed tube (130 kV) | ||
X-ray detector | Flat panel detector | ||
Inspected
PCBs |
Size | M-size PCB (50 mm x 50 mm to
330 mm x 255 mm); thickness: 0.4 mm to 3.0 mm |
PCB (50 mm x 50 mm to
610 mm x 610 mm); thickness: 0.6 mm to 7.0 mm |
Weight | 2.0 kg or lighter
(with components mounted) |
12.0 kg or lighter
(with components mounted) |
|
Mounted component height | Top: 50 mm or shorter; bottom: 20 mm or shorter | ||
Warpage/Flexure | 2.0 mm or less | 3.0 mm or less | |
Device
specifications |
Dimensions | 1,550(W) x 1,650(D) x 1,620(H)mm | 2,180 (W) x 2,500 (D) x 1,720 (H) mm |
Weight | Approx. 2,920 kg | Approx. 5,250 kg | |
PCB transfer height | 900±15 mm | ||
Power supply voltage | Single phase,
200/210/220/230/240 VAC (± 10%), 50/60 Hz |
3 phase, 200/210/220/230/240 VAC,
380/405/415/440 VAC (± 10%), 50/60 Hz |
|
Rated power | 3.1 kVA | 4.7 kVA | |
X-ray leakage | Less than 0.5 μSv/h |