Question
What is the difference between MY4H and MY4 General-purpose Relays?
Answer
Classification by Type of Protection
Item | Features | Representative model | Atmosphere conditions | ||
Mounting structure | Type of protection | Dust and dirt | Corrosive gases | ||
Plug-in Relays | Unsealed (cased) | Structure that protects against contact with foreign material by means of enclosure in a case (designed for manual soldering) | MY | Some protection (No large dust or dirt particles inside Relay.) | No protection |
Plastic sealed | Structure sealed with resin case or cover that provides resistance against atmospheres containing corrosive gases affecting the Relay | G2A-434 | OK | OK See note. | |
Hermetically sealed | Structure with metal or glass enclosure and base hermetically sealed with inert gas (N2) that provides resistance against harmful corrosion to prevent corrosive gases from penetrating the Relay | MYH | OK | OK | |
Screw (metal)- mounting Relays | Open | Structure that provides protection against contact and penetration of foreign matter | MM2 | No protection | No protection |
Enclosed (cased) | Structure that protects against contact with foreign material by means of enclosure in a case (designed for manual soldering) | G7J | Some protection (No large dust or dirt particles inside Relay.) | No protection |
Note:
Using Relays in an Atmosphere Containing Corrosive Gas
(Silicon, Sulfuric, or Organic Gas)
Do not use Relays in a location where silicon gas, sulfuric gas (SO2 or H2S), or organic gas is present.
If Relays are stored or used for an extended period of time in an atmosphere of sulfuric gas or organic gas, contact surfaces may become corroded and cause contact instability and obstruction, and terminal soldering characteristics may be degraded.
Also, if Relays are stored or used for an extended period of time in an atmosphere of silicon gas, a silicon film will form on contact surfaces, causing contact failure.
The effects of corrosive gas can be reduced by the processing shown in the following table.
Item | Processing |
Outer case, housing | Seal structure using packing. |
Relay | Use a Plastic Sealed Relay (except in silicon atmospheres) or a Hermetically Sealed Relay. |
PCB, copper plating | Apply coating. |
Connectors | Apply gold plating or rhodium plating. |
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